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Journal description
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Details for article 10 of 27 found articles
| Title: |
Mechanism and thermal effect of delamination in light-emitting diode packages |
| Author: |
Hu, Jianzheng Yang, Lianqiao Whan Shin, Moo |
| Appeared in: |
Microelectronics journal |
| Paging: | Volume 38 () nr. 2 pages 157-163 |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 10 of 27 found articles
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