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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 2 of 15 found articles
| Title: |
Characterisation of electroplated Sn/Ag solder bumps |
| Author: |
Bigas, M. Cabruja, E. |
| Appeared in: |
Microelectronics journal |
| Paging: | Volume 37 () nr. 4 pages 308-316 |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 15 found articles
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