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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 9 of 14 found articles
| Title: |
Packaging and thermal evaluation of thermally operated intelligent micropump unit |
| Author: |
Morrissey, A Alderman, J Kelly, G Kohári, Zs Páhi, A Rencz, M |
| Appeared in: |
Microelectronics journal |
| Paging: | Volume 30 () nr. 11 pages 1109-1114 |
| Year: |
1999 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 9 of 14 found articles
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