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                                       Details for article 7 of 14 found articles
 
 
  Modelling thermal effects of large contiguous voids in solder joints
 
 
Title: Modelling thermal effects of large contiguous voids in solder joints
Author: Ciampolini, L.
Ciappa, M.
Malberti, P.
Regli, P.
Fichtner, W.
Appeared in: Microelectronics journal
Paging: Volume 30 () nr. 11 pages 1115-1123
Year: 1999
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 7 of 14 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands