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                                       Details for article 11 of 12 found articles
 
 
  Some issues for microsystem packaging in plastic and 3D
 
 
Title: Some issues for microsystem packaging in plastic and 3D
Author: Morrissey, A.
Kelly, G.
Alderman, J.
Barrett, J.
Lyden, C.
O'Rourke, L.
Appeared in: Microelectronics journal
Paging: Volume 29 () nr. 9 pages 645-650
Year: 1998
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 11 of 12 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands