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  A 0.6 micron triple level metal process for high performance application specific integrated circuits
 
 
Title: A 0.6 micron triple level metal process for high performance application specific integrated circuits
Author: Jain, V.
Pramanik, D.
Weling, M.
Gabriel, C.
Baker, D.
Boardman, W.
Eakin, J.
Appeared in: Microelectronics journal
Paging: Volume 25 () nr. 4 pages xviii-xxv
Year: 1994
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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 Koninklijke Bibliotheek - National Library of the Netherlands