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                                       Details for article 11 of 17 found articles
 
 
  Multichip modules- uniting device and package technology?
 
 
Title: Multichip modules- uniting device and package technology?
Author: Szweda, Roy
Appeared in: Microelectronics journal
Paging: Volume 23 () nr. 2 pages 88-89
Year: 1992
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 11 of 17 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands