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                                       Details for article 51 of 55 found articles
 
 
  Thermal Design of Electronic Circuit Boards and Packages
 
 
Title: Thermal Design of Electronic Circuit Boards and Packages
Author: Pitt, Keith
Appeared in: Microelectronics journal
Paging: Volume 18 () nr. 5 pages 46
Year: 1987
Contents:
Publisher: Benn Electronics Publications Ltd.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 51 of 55 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands