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Journal description
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Details for article 15 of 24 found articles
| Title: |
Curing kinetics of a novel commercial epoxy-phenolic composite build-up film for flip-chip ball grid array (FCBGA) substrates |
| Author: |
Ding, Shanjun Zhao, Jingyi Wu, Xiaomeng Chen, Chuan Fang, Zhidan Wang, Qidong |
| Appeared in: |
Microelectronics journal |
| Paging: | Volume 161 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 24 found articles
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