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                                       Details for article 18 of 25 found articles
 
 
  Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer
 
 
Title: Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer
Author: Huang, Yuxuan
Tao, Zhihua
Cai, Xudong
Long, Zhiyuan
Lin, Zewei
Li, Wenlei
Fang, Zhen
Wang, Lingyue
He, Siqi
Cai, Xingzhou
Li, Yong
Zhang, Jihua
Appeared in: Microelectronics journal
Paging: Volume 152 () nr. C pages p.
Year: 2024
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 18 of 25 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands