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Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer |
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Title: |
Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer |
Author: |
Huang, Yuxuan Tao, Zhihua Cai, Xudong Long, Zhiyuan Lin, Zewei Li, Wenlei Fang, Zhen Wang, Lingyue He, Siqi Cai, Xingzhou Li, Yong Zhang, Jihua |
Appeared in: |
Microelectronics journal |
Paging: |
Volume 152 () nr. C pages p. |
Year: |
2024 |
Contents: |
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Publisher: |
Elsevier Ltd |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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