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Journal description
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Details for article 18 of 25 found articles
| Title: |
Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer |
| Author: |
Huang, Yuxuan Tao, Zhihua Cai, Xudong Long, Zhiyuan Lin, Zewei Li, Wenlei Fang, Zhen Wang, Lingyue He, Siqi Cai, Xingzhou Li, Yong Zhang, Jihua |
| Appeared in: |
Microelectronics journal |
| Paging: | Volume 152 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 18 of 25 found articles
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