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Journal description
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Details for article 8 of 32 found articles
| Title: |
Analytical equivalent circuit modeling and analysis of complex BGA for 3D silicon-interposer packaging |
| Author: |
Tang, Lei Li, Kangrong Zhou, Xingshe Yang, Qiao Pan, Penghui Wu, Daowei Li, Baoxia Wang, Yanling Kuang, Nailiang Zhang, Liaoliao |
| Appeared in: |
Microelectronics journal |
| Paging: | Volume 143 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 32 found articles
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