|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 19 of 27 found articles
| Title: |
Frequency response and transient analysis of through glass packaging vias using matrix-rational approximation (MRA) technique for three-dimensional ICs |
| Author: |
Kumar, Ajay Dhiman, Rohit |
| Appeared in: |
Microelectronics journal |
| Paging: | Volume 141 () nr. C pages p. |
| Year: |
2023 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 19 of 27 found articles
| << previous | next >> |