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Journal description
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Details for article 16 of 18 found articles
| Title: |
Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading |
| Author: |
Cong, S. Zhang, W.W. Liu, P. Han, Y.N. Tian, Y.H. |
| Appeared in: |
Microelectronics journal |
| Paging: | Volume 121 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 16 of 18 found articles
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