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Journal description
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Details for article 15 of 26 found articles
| Title: |
Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package |
| Author: |
Liu, Jinshan Li, Jinhui Wang, Tao Huang, Dongxu Li, Zhipeng Zhong, Ao Liu, Wen Sui, Yuying Liu, Qiang Niu, Fangfang Zhang, Guoping Sun, Rong |
| Appeared in: |
Polymer |
| Paging: | Volume 244 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 26 found articles
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