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Journal description
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Details for article 2 of 47 found articles
| Title: |
Analysis of the BGA solder Sn–3.0Ag–0.5Cu crack interface and a prediction of the fatigue life under tensile stress |
| Author: |
Chen, Yilong Jia, Jianyuan Fu, Hongzhi Zeng, Zhi |
| Appeared in: |
International journal of fatigue |
| Paging: | Volume 87 (2016) nr. C pages 9 p. |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 47 found articles
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