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Effect of electrodeposited Cu interlayer thickness on characterizations and adhesion force of Ni/Cu/Ni coatings on polyetherimide composite substrates |
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Titel: |
Effect of electrodeposited Cu interlayer thickness on characterizations and adhesion force of Ni/Cu/Ni coatings on polyetherimide composite substrates |
Auteur: |
Xie, Dingkai Wu, Wangping Huang, Jiaqi Wang, Xiang Zhang, Yi Wang, Zhizhi Jiang, Peng Tang, Lixin Wu, Fulong Wang, Qinqin |
Verschenen in: |
International journal of adhesion and adhesives |
Paginering: |
Jaargang 129 () nr. C pagina's p. |
Jaar: |
2024 |
Inhoud: |
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Uitgever: |
Elsevier Ltd |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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