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                                       Details for article 3 of 19 found articles
 
 
  Diluting and annealing effects on electromigration and morphology of chemical vapor-deposited copper films
 
 
Title: Diluting and annealing effects on electromigration and morphology of chemical vapor-deposited copper films
Author: Wu, S.
Li, X.-F.
Liu, X.
Wang, Q.
Appeared in: Vacuum
Paging: Volume 80 (2006) nr. 8 pages 5 p.
Year: 2006
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 3 of 19 found articles
 
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