|
Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board |
|
|
|
Titel: |
Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board |
Auteur: |
Hong, Yan You, Xiangqing Zeng, Yi Chen, Yuanming Huang, Yunzhong He, Wei Wang, Shouxu Wang, Chong Zhou, Guoyun Su, Xinhong Zhang, Weihua |
Verschenen in: |
Vacuum |
Paginering: |
Jaargang 170 (2019) nr. C pagina's p. |
Jaar: |
2019 |
Inhoud: |
|
Uitgever: |
Elsevier Ltd |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
|
|
|
|