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Journal description
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Details for article 24 of 26 found articles
| Title: |
Structural evolution of Zr-Cu-Ni-Al-N thin film metallic glass and its diffusion barrier performance in Cu-Si interconnect at elevated temperature |
| Author: |
Lee, Joseph Duh, Jenq-Gong |
| Appeared in: |
Vacuum |
| Paging: | Volume 142 (2017) nr. C pages 6 p. |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 24 of 26 found articles
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