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Journal description
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Details for article 33 of 45 found articles
| Title: |
Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach |
| Author: |
Wang, Jianhao Liu, Xunda Huo, Fupeng Kariya, Kento Masago, Noriyuki Nishikawa, Hiroshi |
| Appeared in: |
Materials research bulletin |
| Paging: | Volume 149 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 33 of 45 found articles
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