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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 9 of 9 found articles
| Title: |
Thermomigration in Co/SnAg/Co and Cu/SnAg/Co sandwich structure |
| Author: |
Ouyang, Fan-Yi Hong, Gong-Lin Hsu, Yuan-Ruei Mao, Shan-Yu Liu, Wei-Jun |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 97 (2019) nr. C pages 16-23 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 9 of 9 found articles
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