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Journal description
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Details for article 8 of 10 found articles
| Title: |
Modeling simplification for thermal mechanical stress analysis of TSV interposer stack |
| Author: |
Xia, Kequan Zhu, Zhiyuan Zhang, Hongze Xu, Zhiwei |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 96 (2019) nr. C pages 46-50 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 10 found articles
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