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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
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Details for article 6 of 10 found articles
| Title: |
Investigation of the interfacial reactions between Sn-3.0 wt%Ag-0.5 wt%Cu solder and CuTi alloy (C1990HP) |
| Author: |
Yen, Yee-Wen Laksono, Andromeda Dwi Yang, Chiao-Yi |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 96 (2019) nr. C pages 29-36 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 10 found articles
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