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                                       Details for article 3 of 10 found articles
 
 
  Effect of pulse-reverse plating on copper: Thermal mechanical properties and microstructure relationship
 
 
Title: Effect of pulse-reverse plating on copper: Thermal mechanical properties and microstructure relationship
Author: Huang, Bau-Chin
Yang, Cheng-Hsien
Lee, Cheng-Yu
Hu, Yu-Lung
Hsu, Chi-Chang
Ho, Cheng-En
Appeared in: Microelectronics reliability
Paging: Volume 96 (2019) nr. C pages 71-77
Year: 2019
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 3 of 10 found articles
 
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