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                                       Details for article 9 of 12 found articles
 
 
  Phase formation and microstructure evolution in Cu/In/Cu joints
 
 
Title: Phase formation and microstructure evolution in Cu/In/Cu joints
Author: Chiu, Y.S.
Yu, H.Y.
Hung, H.T.
Wang, Y.W.
Kao, C.R.
Appeared in: Microelectronics reliability
Paging: Volume 95 (2019) nr. C pages 18-27
Year: 2019
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 9 of 12 found articles
 
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