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Journal description
All volumes of the corresponding journal
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Details for article 11 of 17 found articles
| Title: |
Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints |
| Author: |
Akbari, Saeed Lövberg, Andreas Tegehall, Per-Erik Brinkfeldt, Klas Andersson, Dag |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 93 (2019) nr. C pages 61-71 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
The Authors |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 17 found articles
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