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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 43 of 47 found articles
| Title: |
Thermal resistance analysis and validation of flip chip PBGA packages |
| Author: |
Chen, Kuo-Ming Houng, Kuo-Hsiung Chiang, Kuo-Ning |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 46 (2006) nr. 2-4 pages 9 p. |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 43 of 47 found articles
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