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Journal description
All volumes of the corresponding journal
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Details for article 12 of 12 found articles
| Title: |
Shear strength and fracture surface analysis of Sn58Bi/Cu solder joints under a wide range of strain rates |
| Author: |
Wan, Yongqiang Li, Shuang Hu, Xiaowu Qiu, Yu Xu, Tao Li, Yulong Jiang, Xiongxin |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 86 (2018) nr. C pages 27-37 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 12 found articles
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