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Journal description
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Details for article 8 of 40 found articles
| Title: |
Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue |
| Author: |
Dudek, R. Hildebrand, M. Rzepka, S. Fries, T. Döring, R. Seiler, B. Ortmann, R.W. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 83 (2018) nr. C pages 162-172 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 40 found articles
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