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Journal description
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Details for article 32 of 40 found articles
| Title: |
Realistic non-destructive testing of integrated circuit bond wiring using 3-D X-ray tomography, reverse engineering, and finite element analysis |
| Author: |
Favata, Joseph Shahbazmohamadi, Sina |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 83 (2018) nr. C pages 91-100 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 32 of 40 found articles
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