|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 26 of 40 found articles
| Title: |
Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling |
| Author: |
Libot, J.B. Alexis, J. Dalverny, O. Arnaud, L. Milesi, P. Dulondel, F. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 83 (2018) nr. C pages 64-76 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 26 of 40 found articles
| << previous | next >> |