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Journal description
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Details for article 23 of 40 found articles
| Title: |
Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables |
| Author: |
Rajaguru, P. Lu, H. Bailey, C. Castellazzi, A. Pathirana, V. Udugampola, N. Udrea, F. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 83 (2018) nr. C pages 146-156 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 23 of 40 found articles
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