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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 4 of 30 found articles
| Title: |
Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes |
| Author: |
Kao, Chin-Li Chen, Tei-Chen |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 82 (2018) nr. C pages 204-212 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 30 found articles
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