|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 16 of 30 found articles
| Title: |
Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment |
| Author: |
Ali, Bakhtiar Sabri, Mohd Faizul Mohd Said, Suhana Mohd Sukiman, Nazatul Liana Jauhari, Iswadi Mahdavifard, Mohammad Hossein |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 82 (2018) nr. C pages 171-178 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 16 of 30 found articles
| << previous | next >> |