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Journal description
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Details for article 17 of 46 found articles
| Title: |
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches |
| Author: |
Ng, Fei Chong Abas, Aizat Abdullah, M.Z. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 81 (2018) nr. C pages 41-63 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 17 of 46 found articles
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