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Journal description
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Details for article 35 of 39 found articles
| Title: |
The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints |
| Author: |
Tian, Yu Han, Jing Ma, Limin Guo, Fu |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 80 (2018) nr. C pages 7-13 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 35 of 39 found articles
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