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Journal description
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Details for article 3 of 39 found articles
| Title: |
Applications of fracture mechanics to quantitative accelerated life testing of plastic encapsulated microelectronics |
| Author: |
Evans, John W. Sinha, Koustav |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 80 (2018) nr. C pages 317-327 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 39 found articles
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