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Journal description
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Details for article 24 of 39 found articles
| Title: |
Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test |
| Author: |
Guo, Qiang Sun, Siyu Zhang, Zhihao Chen, Hongtao Li, Mingyu |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 80 (2018) nr. C pages 144-148 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 24 of 39 found articles
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