|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 21 of 39 found articles
| Title: |
Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints |
| Author: |
Kunwar, Anil Shang, Shengyan Råback, Peter Wang, Yunpeng Givernaud, Julien Chen, Jun Ma, Haitao Song, Xueguan Zhao, Ning |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 80 (2018) nr. C pages 55-67 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 39 found articles
| << previous | next >> |