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                                       Details for article 17 of 39 found articles
 
 
  Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling
 
 
Title: Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling
Author: Gu, Jian
Lin, Jian
Lei, Yongping
Fu, Hanguang
Appeared in: Microelectronics reliability
Paging: Volume 80 (2018) nr. C pages 29-36
Year: 2018
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 17 of 39 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands