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Journal description
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Details for article 62 of 66 found articles
| Title: |
Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate |
| Author: |
Chen, Cheng Hou, Fengze Liu, Fengman She, Qian Cao, Liqiang Wan, Lixi |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 79 (2017) nr. C pages 10 p. |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 62 of 66 found articles
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