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Journal description
All volumes of the corresponding journal
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Details for article 59 of 66 found articles
| Title: |
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits |
| Author: |
Melamed, Samson Watanabe, Naoya Nemoto, Shunsuke Shimamoto, Haruo Kikuchi, Katsuya Aoyagi, Masahiro |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 79 (2017) nr. C pages 7 p. |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 59 of 66 found articles
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