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Journal description
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Details for article 25 of 55 found articles
| Title: |
Effects of acrylic adhesives property and optimized bonding parameters on Sn58Bi solder joint morphology for flex-on-board assembly |
| Author: |
Zhang, Shuye Lin, Tiesong He, Peng Paik, Kyung-Wook |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 78 (2017) nr. C pages 9 p. |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 25 of 55 found articles
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