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Journal description
All volumes of the corresponding journal
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Details for article 121 of 133 found articles
| Title: |
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology |
| Author: |
Lee, Chang-Chun Lee, Chien-Chen Ku, Hsiao-Tung Chang, Shu-Ming Chiang, Kuo-Ning |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 47 (2007) nr. 2-3 pages 9 p. |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 121 of 133 found articles
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