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Journal description
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Details for article 14 of 26 found articles
| Title: |
Junction temperature of QFN32 and 64 electronic devices subjected to free convection. Effects of the resin's thermal conductivity |
| Author: |
Baïri, Abderrahmane |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 74 (2017) nr. C pages 7 p. |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 26 found articles
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