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Journal description
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Details for article 10 of 20 found articles
| Title: |
Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration |
| Author: |
Wang, Fengjiang Li, Dongyang Tian, Shuang Zhang, Zhijie Wang, Jiheng Yan, Chao |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 73 (2017) nr. C pages 10 p. |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 10 of 20 found articles
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