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Journal description
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Details for article 3 of 20 found articles
| Title: |
Development of numerical algorithm to guide solder joint structure and component structural design during manufacturing |
| Author: |
Chen, Yilong Jia, Jianyuan Fu, Hongzhi Zhu, Zhaofei |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 71 (2017) nr. C pages 9 p. |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 20 found articles
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