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Journal description
All volumes of the corresponding journal
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Details for article 4 of 15 found articles
| Title: |
Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging |
| Author: |
Pan, Yuanxing Li, Fei He, Hu Li, Junhui Zhu, Wenhui |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 70 (2017) nr. C pages 6 p. |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 15 found articles
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