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Journal description
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Details for article 8 of 24 found articles
| Title: |
Experimental investigation of the failure mechanism of Cu–Sn intermetallic compounds in SAC solder joints |
| Author: |
Yang, Chaoran Le, Fuliang Lee, S.W. Ricky |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 62 (2016) nr. C pages 11 p. |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 24 found articles
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