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Journal description
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Details for article 3 of 24 found articles
| Title: |
An in-situ numerical–experimental approach for fatigue delamination characterization in microelectronic packages |
| Author: |
Poshtan, Emad A. Rzepka, Sven Silber, Christian Wunderle, Bernhard |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 62 (2016) nr. C pages 8 p. |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 24 found articles
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